- Understanding
the complex structure of interconnects with respect to effect of
miniaturization and analyzing the main degradation and failure mechanisms
from a materials science view by application of sophisticated analytical
methods.
- Development and application of
innovative accelerated mechanical test techniques as an alternative to
standardized bloodshed thermal testing for qualification of electronic interconnects
- Development of
accelerated testing techniques for non destructive qualification of
interconnects for detection of hidden defects, flaws, and weaknesses which
would result in failures during usage
- Studying the
time resolved degradation of interconnects by means of vibrational and modal
analysis
- Quantitative
life time prediction of interconnects based on analytical and simulation
methods in combination with the experimental data
- Quantitative relationship of experimental results to in-service reliability, using a
scientific acceleration transform
- Development of
prototypes for screening of certain types of interconnects
- The
technological realization of the gained knowledge for manufacturing improved
product reliability and cost reduction
