K-project Micromat

Lifetime and Reliability of Material Interconnects in Electronics

           A research project at the University of Vienna in the frame of FFG Comet program














Area 1- Projects 1 to 5


Our project is implemented at the University of Vienna, Micromaterials Group by a team of three professors, two scientists, four phd students and diploma students.

Project No. 1: Development and optimisation of accelerated destructive test systems

The main objective of this project is optimisation and adaptation of destructive accelerated mechanical testing systems for determination of fatigue lifetime of 1st and 2nd level interconnects and small components (assemblies) by using higher frequencies and resonance testing systems.  This project is primarily concentrated on adaptation of the available test systems to different kind of interconnect technologies described previously and also listed in P3. Application of these systems permit to study the influence of a variety of production parameters on the quality of selected interconnect technologies used by the industrial partners.

Project No. 2: Development of non destructive test systems

The objective of the development of non destructive accelerated mechanical test systems based on vibrational analysis is detection of hidden defects, flaws, voids, micro-cracks and weaknesses of interconnects such as delamination of interfaces, interface cracking etc. in electronic devices and assemblies. The systems will be developed to be used for two different application fields:

1-     In-situ investigation of the deformation characteristics and damage processes of the interconnects 

2-     Application as on-line quality control system for interconnects.

Project No. 3: End of Life (Destructive) and Quasi-Non Destructive Tests

The aim of this project is to study the long time reliability and dominant failure mechanisms of a selection of interconnects, electronic assemblies and devices as a function of production parameters, material combinations, geometry , size, loading modes and temperature. The experiments will be performed to obtain lifetime curves and to study and evaluate the damage accumulation process as well as crack initiation and crack propagation behaviour of selected specimens. All experiments will be performed in interaction with projects P1 and P2.

Project No. 4: Materials Characterization- Physics of Failure

From the material science point of view improvement of the quality of interconnects requires a deeper understanding of the bonding process and related structural changes and failure mechanisms. Thus the objective of this project is detailed characterization and failure analysis of the test structures selected for this project, including interconnects and electronic components. These investigations cover microstructural investigations, chemical analysis and determination of mechanical and physical properties of the specimens as a function of production parameters and materials.

Project No. 5: Lifetime Modelling and Prediction

The main objective of this project is to establish the theoretical basis for the extensive data obtained in the field of materials science and measurement techniques of this project by modelling and simulation.