Area 1- Projects 1 to 5
Our project is
implemented at the University of Vienna, Micromaterials Group by a team of three
professors, two scientists, four phd students and diploma students.
Project No. 1: Development and optimisation of accelerated destructive test
The main objective of this project
is optimisation and adaptation of destructive accelerated mechanical testing
systems for determination of fatigue lifetime of 1st and 2nd level interconnects
and small components (assemblies) by using higher frequencies and resonance
testing systems. This project is primarily concentrated on adaptation of the
available test systems to different kind of interconnect technologies described
previously and also listed in P3. Application of these systems permit to study
the influence of a variety of production parameters on the quality of selected
interconnect technologies used by the industrial partners.
Project No. 2: Development of non destructive test systems
The objective of the development of
non destructive accelerated mechanical test systems based on vibrational
analysis is detection of hidden defects, flaws, voids, micro-cracks and
weaknesses of interconnects such as delamination of interfaces, interface
cracking etc. in electronic devices and assemblies. The systems will be
developed to be used for two different application fields:
In-situ investigation of the deformation characteristics and damage processes of
Application as on-line quality control system for interconnects.
Project No. 3: End of Life (Destructive) and Quasi-Non Destructive Tests
The aim of this project is to study
the long time reliability and dominant failure mechanisms of a selection of
interconnects, electronic assemblies and devices as a function of production
parameters, material combinations, geometry , size, loading modes and
temperature. The experiments will be performed to obtain lifetime curves and to
study and evaluate the damage
accumulation process as well as crack initiation and crack propagation behaviour
of selected specimens. All experiments will be performed in interaction with
projects P1 and P2.
Project No. 4: Materials Characterization- Physics of Failure
From the material science point of
view improvement of the quality of interconnects requires a deeper understanding
of the bonding process and related structural changes and failure mechanisms.
Thus the objective of this project is detailed characterization and failure
analysis of the test structures selected for this project, including
interconnects and electronic components. These investigations cover
microstructural investigations, chemical analysis and determination of
mechanical and physical properties of the specimens as a function of production
parameters and materials.
Project No. 5: Lifetime Modelling and Prediction
main objective of this project is to establish the theoretical basis for the
extensive data obtained in the field of materials science and measurement
techniques of this project by modelling and simulation.