K-project Micromat

Lifetime and Reliability of Material Interconnects in Electronics

           A research project at the University of Vienna in the frame of FFG Comet program
      

 

Home

 

Partners

 

Projects

 

Publications

 

Funding

 

Contact


 

Master/ Diploma Thesis and PHD Thesis

          6 Diploma thesis/ master Thesis were accomplished

          5 PHD thesis in cooperation with scientific and industrial partners (since 2011)

Publications in Journals and Conference Proceedings

  1. A fast test technique for life time estimation of ultrasonically welded Cu-Cu interconnects, B. Czerny, G. Khatibi, B. Weiss, T. Licht, Microelectronics Reliability, Vol 50, Issue 9-11,P. 1641-1644 (2010)

  2. Lifetime of Thermosonic Copper Ball bonds on Aluminium Metallization Pads, W. Trasischker, A. Lassnig, G. Khatibi, B. Weiss, M. Nelhiebel, R. Pelzer, Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International

  3. Reliability and vibrational fatigue response of ball grid array packages, M. Lederer, G. Khatibi, B. Weiss, H. Ipser, presented at Micro-car March 2011, Leipzig, Germany, published in Micromaterials and Nanomaterials 13 (2011)

  4. Influence of Ti- surface contamination on reliability of Al wire bonds, G. Khatibi, S. Puchner, B. Weiss, A. Zechmann, T. Detzel, H. Hutter, Proceedings of EMPC, Brighton, UK, Sep (2011)

  5. Accelerated lifetime estimation of thermosonic Cu ball bonds on Al metallization, A. Lassnig, W. Trasischker, G. Khatibi, B. Weiss, M. Nelhiebel, R. Pelzer,Microelectronic Engineering online Feb. 2013, http://dx.doi.org/10.1016/j.mee.2013.02.015

  6. FEM simulation of the size and constraining effect in lead free solder joints, M. Lederer et al., Proceedings of Computational Mechanics Conference November 2011, Pilsen, Czech Rep, J. Applied and Computational Mechanics Vol 6, No 1 (2012)

  7. Quality Assurance for Wire Connections used in Integrated Circuits via Magnetic Imaging, P. Hölzl et al, Proceedings of IMTC 2012 Graz Austria( 2012)

  8. Influence of Miniaturization on Mechanical Reliability of Lead-free Solder Interconnects,  G. Khatibi, H. Ipser, M. Lederer,  B. Weiss, Solder Joint reliability,  Book Chapter “Lead-Free solders- Materials for Reliability” ed. K.N. Subramanian, Wiley Series in Materials for Electronic & Optoelectronic Ap (2012)

  9. Damage accumulation and fracture initiation in aged lead free Sn3.5Ag solder joints, M. Lederer et. al., Chemical Monthly, 14309/2012,  p. 1335 – 1339

  10. Stress-strain behavior of lead free solder joints determined by digital image correlation techniques and FEM simulations, G. Khatibi et al. TMS March 2012, Orlando, Fl and Journal of Electronic Materials, DOI : 10.1007/s11664-012-2276-2, 2012

  11. Investigations of interfacial features in thick Al wire bonds, G. Khatibi et al. Journal of Electronic Materials, DOI : 10.1007/s11664-012-2215-2., 2012. PDF

  12. In situ vibration measurements on power modules under operating conditions, B. Czerny et al., Proc. of 13th EuroSimE, IEEE Components, Packaging Manuf. Technol. Soc.(2012)

  13. Accelerated lifetime measurements of Cu-Al ball bonded interconnects, A. Lassnig, Proc. of 13th EuroSimE, IEEE Components, Packaging Manuf. Technol. Soc.(2012)

  14. High Temperature Storage Reliability Investigation of the Al-Cu Wire Bond Interface, R. Pelzer et al. ESREF 2012, Microelectronics Reliability,52, Issues (9-10) 2012, Pages 1966-1970

  15. Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions, B. Czerny, M. Lederer, B. Nagl, A. Trnka, G. Khatibi, M. Thoben,Microelectronic Reliability, Volume 52, Issues 9–10, 2012, Pages 2353–2357

  16. Constitutive modeling of pressure dependent plasticity and fracture in solder joints, M. Lederer, et al. International Journal of Solids and Structures, Volume 49, Issues 23–24, 15 November 2012, Pages 3453-3460

  17. Electro-thermal analysis of in situ vibration measurements on IGBT modules under operating conditions, B. Nagl, B. Czerny, M. Lederer, G. Khatibi, M. Thoben, J. Nicolics, Proc. of Electronics System Integration Technology Conferences (ESTC) IEEE-CPMTconference, 2012

  18. An ultrafast mechanical test system for bending fatigue studies of multilayered electronic components, W. Ress, G. Khatibi, B. Weiss, V. Gröger,  Proc. of Electronics System Integration Technology Conferences (ESTC) IEEE-CPMTconference (2012)

  19. Non-destructive damage detection using a scanning laser Doppler vibrometer and the correlation method, B. Rafiee, M. Lederer , G. Khatibi, NDE for Safety, 42nd International Conference and NDT Technique Exposition (2012)

  20. Application of accelerated mechanical test techniques for evaluation of microelectronic components,G. Khatibi et al., Micromaterials and Nanomaterials 2013,  Proceedings Microcar 2013, 25. - 26. Feb 2013, Leipzig

  21. Influence of wirebond shape on its lifetime with application to frame connections, B. Czerny  et al., Proc. of 14th EuroSimE, IEEE Components, Packaging Manuf. Technol. Soc.(2013)

  22. Simulation of stress concentrations in wire-bonds using a novel strain gradient theory, M. Lederer et al., Proc. of 14th EuroSimE, IEEE Components, Packaging Manuf. Technol. Soc.(2013)

  23. Advanced failure analysis of electronic systems using a 3D laser Doppler vibrometer, B. Czerny et al., Proc. 3. Tagung Innovation Messtechnik (2013)

  24. Experimental Investigation of Transient Electrical, Thermal and Mechanical Behavior of IGBT Inverter Modules during Operation, B. Nagl et al., Proc. of 25th Int. Symp. on Power Semiconductor Devices and ICs, ISPSD (2013)

  25. Lifetime Estimation of the Wire bonds in Microelectronic Devices Based on Modal Parameter Damage Detection Method, P. Rafiee et al., Proc. of 5th Int. Conf. on NDT of HSNT-IC, MINDT (2013)

  26. Modeling of fatigue crack initiation in wire-bonds using a novel approach of strain gradient theory, M. Lederer et al., Proc. of 7th Int. Conf. on Materials Structure & Micromechanics of Fracture, MSMF(2013) and Journal of Key Engineering Materials (accepted)

  27. Experimental and analytical study of geometry effects on the  fatigue life of Al bond wire interconnects, B. Czerny et al., Microelectronics Reliability 53 (2013) 1558–1562

  28. Application of quantitative modal analysis for investigation of thermal degradation of microelectronic packages, P. Rafiee et al., Microelectronics Reliability 53 (2013) 1563–1567

  29. A New Approach for Evaluation of Fatigue Life of Al-Wire Bonds in Power Electronics, G. Khatibi et al., Light Metals 2014: Aluminum Alloys: Development, Characterization and Applications

  30. A fast reliability assessment method for Si MEMS based on micro cantilever beams, P. Rafiee et al., Microelectronics Reliability 54 (2014)

    Conference Proceedings (Abstract)

  1. A fast test technique for lifetime estimation of ultrasonically welded Cu-Cu interconnects, B. Czerny, et al. 22nd Colloquium on Fatigue Mechanisms, Vienna Austria, March 2011

  2. Application of Laser Vibrometry in Microelectronics, B. Czerny, Polytech User Meeting, Vienna Austria, September 2011

  3. Influence of heat treatment on fatigue life of Cu-Al interconnects, A. Lassnig, et al. 23rd Colloquium on Fatigue Mechanisms, Poitier France March 2012

  4. Accelerated mechanical testing as an alternative method for reliability assessment of electronic devices, G. Khatibi, B. Weiss, Materials Science and Engineering Conference MSE, Darmstadt, Germany, September 2012

  5. Accelerated mechanical testing as an alternative method for qualification of electronic devices, G. Khatibi, M. Lederer, B. Weiss,  EIPC Winter Conference, Jan 31- Feb 1 2013, Berlin

  6. Analytical and experimental study of geometry effects on the fatigue life of Al bond wire interconnects, B. Czerny et al. 24rd Colloquium on Fatigue Mechanisms, Freiberg, Germany March 2013

  7. Effect of intermetallic compound formation on crack path morphologies in Al-Cu interfaces, A. Lassnig et al., 24rd Colloquium on Fatigue Mechanisms, Freiberg, Germany March 2013

  8. Effect of intermetallic phases on mechanical properties of Al-Cu interfaces, A. Lassnig et al. Euromat 2013, 8- 13th Sept 2013, Sevilla, Spain

  9. ESREF Workshop on Application of accelerated mechanical testing for evaluation of electronic devices, ESREF 2013, the 24th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, September 30th to October 4th 2013, Arcachon France

  10. Vibrational based damage analysis of microelectronic packages, P. Rafiee e al. TMS 2014, February 16-20, Dan Diego, USA

    Downloads

    Comet fact sheets E, D

    FFG in Focus

    Spannungen lösen (Forschungsnewsletter Uni Wien)

    Geschüttelt, nicht erhitzt (Forschung Spezial, Der Standard)

    Belastungstest für Verbindungen (Siemens Hitech)

    Verlässliche Arbeit der Halbleiter (Die Presse)